Overview
Moonstone
Moonstone™ is a high power, multi-channel, single or multi-wavelength DFB laser source. Compared to butterfly packages, Moonstone™ has a smaller footprint, better operating temperature ranges and is field replaceable with advanced packaging at a much lower price point. Ideal for telecommunications, LIDAR, ethernet switching, along with a broad range of test and sensor equipment.
Replace
4 Butterfly Laser DiodesWith
One Moonstone™Key Technology
FREE-SPACE OPTICAL PACKAGE ASSEMBLY
Moonstone is fabricated using an automation optical packaging assembly process. Off-the-shelf laser chips (with single or multi-wavelengths) are mounted on the carrier and submount using eutectic soldering and die-bonding techniques. The laser chips are connected to the FPC through wire bonding. In the single-wavelength scenario, free-space coupling is employed using lens to focus the laser light into fiber.
In the multi-wavelength scenario, laser light is colllimated into MUX which acts as a beam combiner, and then focused into a single fiber. A TEC is placed underneath to control the temperature of the laser with the aid of thermistor. The base and submount are both materials that have matchable heat conductivity. Moonstone has standard MT ferrule and FPC connector as optical and electrical interfaces, respectively.
Approach
Utilized compact-size high-power DFB laser chip
Based on free-space optical alignment with the guidance of optical design
Customized packaging using eutectic soldering, die-bonding and wire-bonding techniques
Optimized thermal control solution based on TEC
Highlights
Low-cost and low process requirements
Precise thermal control
Low laser-to-fiber coupling loss
Up to 8 wavelengths
High output power
Usage Scenario